Electronic device having selectively strengthened glass

ABSTRACT

Embodiments disclosed therein generally pertain to selectively strengthening glass. More particularly, techniques are described for selectively strengthening cover glass, which tends to be thin, for electronic devices, namely, portable electronic devices.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation patent application of U.S. Pat.Application No. 16/878,393, May 19, 2020 and titled “Electronic DeviceHaving Selectively Strengthened Glass,” which is a continuation patentapplication of U.S. Pat. Application No. 15/660,839, filed Jul. 26, 2017and titled “Electronic Device Having Selectively Strengthened Glass,”now U.S. Pat. No. 10,676,393, which is a continuation patent applicationof U.S. Pat. Application No. 13/235,090, filed Sep. 16, 2011 and titled“Electronic Device Having Selectively Strengthened Glass,” now U.S. Pat.No. 9,725,359, which is a nonprovisional patent application of andclaims the benefit of U.S. Provisional Pat. Application No. 61/453,404,filed Mar. 16, 2011 and titled “Electronic Device Having SelectivelyStrengthened Glass,” the disclosures of which are hereby incorporatedherein by reference in their entireties.

BACKGROUND

Conventionally, small form factor devices, such as handheld electronicdevices, have a display arrangement that includes various layers. Thevarious layers include at least a display technology layer.Additionally, a sensing arrangement and/or a cover window may bedisposed over the display technology layer. By way of example, thedisplay technology layer may include or pertain to a Liquid CrystalDisplay (LCD) that includes a Liquid Crystal Module (LCM). The LCMgenerally includes an upper glass sheet and a lower glass sheet thatsandwich a liquid crystal layer there between. The sensing arrangementmay be a touch sensing arrangement such as those used to create a touchscreen. For example, a capacitive sensing touch screen can includesubstantially transparent sensing points or nodes dispersed about asheet of glass (or plastic). In addition, the cover window, which istypically designed as the outer protective barrier, may be glass orplastic. Glass tends to provide a better protective barrier given itsstrength and scratch resistance. There is, however, a continuing needfor improved approaches for glass cover arrangements for electronicdevices.

SUMMARY

Embodiments disclosed therein generally pertain to selectivelystrengthening glass. More particularly, techniques are described forselectively strengthening cover glass, which tends to be thin, forelectronic devices, namely, portable electronic devices.

The invention can be implemented in numerous ways, including as amethod, system, device or apparatus. Several embodiments of theinvention are discussed below.

As a consumer electronic product, one embodiment can, for example,include at least a housing, electrical components disposed at leastpartially internal to the housing, and a cover glass coupled with thehousing. The cover glass includes a selectively chemically strengthenedsurface region.

As a method for assembling an electronic product, one embodiment can,for example, include at least obtaining cover glass and selectivelychemically strengthening one surface region of the cover glassdifferently than chemically strengthening an other surface region of thecover glass. Thereafter, the cover glass can be attached to a housingfor the electronic product.

As a method for assembling an electronic product, one embodiment can,for example, include at least obtaining cover glass and shielding aportion of the cover glass. The shielding provides the cover glass withat least one shielded portion and at least one unshielded portion. Theembodiment can also chemically strengthening the at least one unshieldedportion of the cover glass. Thereafter, the cover glass can be attachedto a housing for the electronic product.

As a method for assembling an electronic product, one embodiment can,for example, include at least obtaining cover glass and chemicallystrengthening the cover glass. Strengthening of a selected portion ofthe cover glass can be selectively enhanced. Thereafter, the cover glasscan be attached to a housing for the electronic product.

Other aspects and advantages of the invention will become apparent fromthe following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIGS. 1A and 1B are various views of an electronic device in accordancewith one embodiment.

FIG. 2 shows a detailed partial cross sectional view of selectivestrengthening of exposed surface portions of cover glass.

FIGS. 3A-3E are simplified cross sectional views showing selectivestrengthening of cover glass in one embodiment.

FIGS. 4A-4E are simplified cross sectional views showing selectivestrengthening of cover glass in another embodiment.

FIGS. 5A-5G are simplified cross sectional views showing selectivestrengthening of cover glass in yet another embodiment.

FIGS. 6A-6E are simplified cross sectional views showing selectivestrengthening of cover glass in still yet another embodiment.

FIG. 7 is a flow diagram showing one embodiment of an assembly process.

FIG. 8 is a flow diagram showing another embodiment of an assemblyprocess.

FIG. 9 is a flow diagram showing yet another embodiment of an assemblyprocess.

FIG. 10 is a flow diagram showing still another embodiment of anassembly process.

FIG. 11 is a perspective view of an electronic device in accordance withanother embodiment.

DETAILED DESCRIPTION

Embodiments disclosed therein generally pertain to selectivelystrengthening glass. More particularly, techniques are described forselectively strengthening cover glass, which tends to be thin, forelectronic devices, namely, portable electronic devices.

Embodiments of the invention are discussed below with reference to FIGS.1A-11 . However, those skilled in the art will readily appreciate thatthe detailed description given herein with respect to these figures isfor explanatory purposes as the invention extends beyond these limitedembodiments.

FIGS. 1A and 1B are various views of an electronic device 100 inaccordance with one embodiment. The electronic device 100 may, forexample, be embodied as portable or handheld electronic device having athin form factor (or low profile). The electronic device 100 can, forexample, correspond to a media player, a media storage device, aPortable Digital Assistant (PDA), a tablet PCs, a computer, a cellularphone, a smart phone, a GPS unit, a remote control, and the like.

As shown in cross sectional view in FIG. 1A, the electronic device 100may include a housing 102 that serves as the outer surface for theelectronic device 100. Electrical components 103 may be disposed withinthe housing 102. The electrical components may include, but are notlimited to, a controller (or processor), memory, battery, display,camera, and illuminator such as a flash.

Additionally, the electronic device 100 may have a cover glass 104. Thecover glass 104 may serve as an external surface, i.e., top surface, forthe electronic device 100. The cover glass 104 may also resistscratching and therefore may provide a substantially scratch-resistancesurface for the top surface of the housing 102 for the electronic device100. The cover glass 104 may be coupled to the housing 102, for example,using an adhesive 105.

The electronic device 100 is shown in perspective view in FIG. 1B. Coverglass 104 may be provided over a display area. The cover glass 104 maybe substantially transparent so that the display area can be viewedthrough the cover glass 104. The display area may be disposed within thehousing 102 of the electronic device 100. The electronic device 100 mayinclude a full view or substantially full view display area thatconsumes a majority of the front surface of the electronic device 100.The display area may be embodied in a variety of ways. In one example,the display area may comprise at least a display such as a flat paneldisplay and more particularly an LCD display.

The display area may alternatively or additionally include a touchsensing device positioned over a display screen. For example, thedisplay area may include one or more glass layers having capacitivesensing points distributed thereon. Each of these components may beseparate layers or they may be integrated into one or more stacks. Inone embodiment, the cover glass 104 may act as the outer most layer ofthe display area. The adhesive 105 can be translucent and extend aroundthe periphery so as to not optically interfere with the display area.

The electronic device 100 may include a display region (e.g., thedisplay area) that includes various layers. The various layers mayinclude at least a display, and may additionally include a sensingarrangement disposed over the display. In some cases, the layers may bestacked and adjacent one another, and may even be laminated therebyforming a single unit. In other cases, at least some of the layers arespatially separated and not directly adjacent.

For example, the sensing arrangement may be disposed above the displaysuch that there is a gap there between. By way of example, the displaymay include a Liquid Crystal Display (LCD) that includes a LiquidCrystal Module (LCM). The LCM generally includes at least an upper glasssheet and a lower glass sheet that at least partially sandwich a liquidcrystal layer there between. The sensing arrangement may be a touchsensing arrangement such as those used to create a touch screen.

For example, a capacitive sensing touch screen may include substantiallytransparent sensing points or nodes dispersed about cover glass 104. Thecover glass 104 may serve as the outer protective barrier for thedisplay region. Typically, the cover glass 104 may be adjacent to thedisplay region, but may also be integrated with the display region, suchas another layer (outer protective layer).

As shown in FIG. 1B, the cover glass 104 may extend across the entiretop surface of the housing 102. In such a case, the edges of the coverglass 104 may be aligned, or substantially aligned, with the sides ofthe housing 102. Given that the thickness of the cover glass 104 may berather thin (i.e., less than a few millimeters), the glass material forthe cover glass 104 can be selected from available glass that isstronger. For example, alumino silicate glass (e.g., DVTS from Corning)is one suitable choice for the glass material for the cover glass 104.Other examples of glass materials include, but are not limited toincluding, sodalime, borosilicate, and the like. Still another exampleof glass material may be lithium based glass. Additionally, the edges ofthe cover glass 104 can be configured to correspond to a particularpredetermined geometry. By machining the edges of the cover glass 104 tocorrespond to the particular predetermined geometry, the cover glasspieces can become stronger. For additional information about use ofpredetermined geometries, see U.S. Provisional Pat. Application No.61/156,803, filed Mar. 2, 2009 and entitled “Techniques forStrengthening Glass Covers for Portable Electronic Devices”, whichhereby incorporated herein by reference in its entirety.

Moreover, as will be discussed in greater detail subsequently herein,the cover glass 104 can be selectively chemically treated for furtherstrengthening. One suitable chemical treatment is to selectively exposeone or more surface portions of the cover glass in a chemical bathcontaining potassium (e.g., KNO3) for a period of time (e.g., severalhours) at an elevated temperature. Additionally, baths containing sodiummay be used in conjunction with Lithium baths, as this combination mayproduce a compressive stress layer. In any case, the selective chemicaltreatment can desirably result in higher compression stresses at theselectively exposed surface portions of the cover glass pieces. Thehigher compression stresses may be the result ion exchange wherein K⁺ions effectively replacing some Na⁺ ions at or near the selectivelyexposed surface portions of the cover glass.

As particularly shown in FIG. 1B, a selectively chemically strengthenedsurface region 110A may comprise a selectively strengthened edgeextremity 110A of the cover glass. The selectively chemicallystrengthened surface region 110A may have a width dimension, w,extending inwardly from peripheral edges of the cover glass. In otherwords, the selectively strengthened edge extremity 110A may have a widthdimension, w. The width dimension may be about two to five millimeters,or more. For example the width dimension may be about ten millimeters. Anotional dashed line in FIG. 1B representatively illustrates an innerextent of the selectively chemically strengthened surface region 110A.

The apparatus, systems and methods according to embodiments describedherein are especially suitable for cover glasses or displays (e.g., LCDdisplays) assembled in small form factor electronic devices such ashandheld electronic devices (e.g., mobile phones, media players,personal digital assistants, remote controls, etc.) The apparatus,systems and methods can also be used for cover glasses or displays forother relatively larger form factor electronic devices (e.g., portablecomputers, tablet computers, displays, monitors, televisions, etc.).

In one embodiment, the size of a glass cover depends on the size of theassociated electronic device. For example, with handheld electronicdevices, the glass cover is often not more than five (5) inchesdiagonal. As another example, for portable electronic devices, such assmaller portable computers or tablet computers, the glass cover is oftenbetween four (4) to twelve (12) inches diagonal. As still anotherexample, for portable electronic devices, such as full size portablecomputers, displays or monitors, the glass cover is often between ten(10) to twenty (20) inches diagonal or even larger. The glass cover istypically rather thin, such as having a thickness less than about 5 mm,or more specifically less than about 3 mm, or more specifically lessthan about 1 mm.

FIG. 2 shows a detailed partial cross sectional view of selectivestrengthening of exposed surface portions of cover glass 204. FIG. 2diagrammatically illustrates a chemical treatment process of submergingthe cover glass 204 in a heated potassium bath 203 (for example a moltenKNO3 bath), for selective chemically strengthening the cover glass 204.For example, the potassium bath may be heated to between aboutthree-hundred and eighty degrees Celsius, and about four-hundred andfifty degrees Celsius. When the cover glass 204 is submerged or soakedin the heated potassium bath 203, diffusion and ion exchange can occurat exposed surface portions of the cover glass 204. Ion exchange may beinhibited in masked areas where corresponding surface portions of thecover glass are not exposed to the chemical bath.

As shown in FIG. 2 , Na⁺ ions 205 which are present in cover glass 204can diffuse into potassium bath 203, while K⁺ ions 207 in potassium bath203 can diffuse into cover glass 204 such that a compressive surfacelayer 209 can be formed. In other words, K⁺ ions 207 from potassium bath203 can be exchanged with Na⁺ ions 205 to form compressive surface layer209. The K⁺ ions 207 can provide a compressive stress surface stress(CS) of the compressive surface layer 209, which chemically strengthensthe compressive surface layer 209 of the cover glass 204.

Cover glass 204 is shown in FIG. 2 as having a thickness (t). Bycontrolling chemical treatment parameters such as the length of time ofchemical strengthening treatment and/or the concentration of K⁺ ions 207in potassium bath 203, a depth (d) of compressive surface layer 209 andcompressive stress surface stress (CS) of the compressive surface layer209 may be substantially controlled. Depth of ion exchange (d) may becontrolled in various ways for various cover glass thicknesses, forexample by using high ion concentrations and/or bath temperatures and/orextended bath soak times, and/or by using applied electric fields toenhance diffusion. For example, bath soak time by be about six hours. InFIG. 2 , the compressive surface layer 209 undergoing ion exchange isshown using cross hatching.

In some cases, K⁺ ions 207 may not diffuse into a center portion 211 ofcover glass 204. In FIG. 2 the center portion 211 is shown without crosshatching. The central portion 211 of the cover glass 204 can have acentral tension (CT) in response to the compressive stress surfacestress (CS) of the compressive surface layer 209.

As mentioned previously herein, ion exchange may be inhibited in maskedareas where corresponding surface portions of the cover glass are notexposed to the chemical bath. Foil can, for example, be used formasking. Further, photolithographic patterning of ion exchange(selective chemical strengthening) of the cover glass may be done byphotolithographically patterning masks thereon. In such case,photosensitive polyimide may be used for masking; or an applied overlayer of aluminum (which may be applied by sputtering) may bephotolithographically patterned into a patterned mask using photoresistand etching of the aluminum.

FIGS. 3A-3E are simplified cross sectional views showing selectivestrengthening of cover glass in one embodiment. FIG. 3A shows coverglass 304 prior to a first strengthening treatment. FIG. 3B shows acover glass 304 after the first strengthening treatment, such astreatment in a first heated potassium bath for a first period of time asdiscussed previously herein.

In FIGS. 3B-3E compressive surface layer 309 from undergoing ionexchange is shown using cross hatching. Compressive surface layer 309can have a corresponding depth of compressive layer. In some cases,potassium ions may not diffuse into a center portion 311 of cover glass304. In FIG. 3B the center portion 311 is shown without cross hatching.The central portion 311 of the cover glass 304 can have a centraltension (CT) in response to the compressive stress surface stress (CS)of the compressive surface layer 309. For example, hypotheticallyspeaking, the following is theorized with respect to possible effects ofthe first strengthening treatment: the compressive surface layer 309 mayhave a peak compressive stress of about seven hundred and thirty MegaPascals (730 Mega Pascals), and a depth of compressive layer of aboutthirty eight point six microns (38.6 microns); and the central portion311 may have a central tension of about fifty-four Mega Pascals (54 MegaPascals.)

FIG. 3C shows shielding 306 of a portion of the cover glass 304, theshielding 306 providing the cover glass 304 with at least one shieldedportion 308 and at least one unshielded portion 310. Suitable masking306 of the cover glass, as discussed previously herein, may be used forthe shielding 306 of the cover glass 304. For example, as shown in FIG.3C opposing major surfaces of the cover glass may be shielded by appliedmask material 306, so as to provide the shielded portion 308 of thecover glass. Edge extremities 310 of the cover glass 304 may beunshielded portions 310. Mask 306 may be suitably patterned as desiredfor shielded portion 308 and unshielded portion 310. For example,unshielded portion 310 may have a width dimension of about two to aboutfive millimeters, or more. For example the width dimension may be aboutten millimeters.

FIG. 3D shows cover glass 304 after a second strengthening treatment,such as treatment in a second heated potassium bath for a second periodof time as discussed previously herein. Strengthening of a selectedunshielded portion 310 of the cover glass can be selectively enhanced bythe second strengthening treatment. Because it is unshielded, unshieldedportion 310 may be substantially affected by the second strengtheningtreatment, so as to provide a selectively chemically strengthenedsurface region 310A. Conversely, because it is shielded, shieldedportion 308 of the other chemically strengthened surface region 308A maybe substantially unaffected by the second strengthening treatment.Accordingly, the selectively chemically strengthened surface region 310Aof the cover glass may have enhanced strengthening that is greater thanstrengthening of the other chemically strengthened surface region 308A.In light of the foregoing, it should be understood that the selectivelychemically strengthened surface region 310A of the cover glass may bestrengthened differently than the other chemically strengthened surfaceregion 308A. After the second strengthening treatment, the shielding 306may be removed as shown in FIG. 3E.

In FIGS. 3D and 3E, the selectively chemically strengthened surfaceregion 310A of the cover glass may have enhanced strengthening with anenhanced depth of compressive layer that is deeper than the depth ofcompressive layer of the other chemically strengthened surface region308A. For example, hypothetically speaking, it is theorized that theenhanced depth of compressive layer of the selectively chemicallystrengthened surface region 310A may be about one hundred microns, whilethe depth of compressive layer of the other chemically strengthenedsurface region 308A may be about thirty eight point six microns.

Comparing FIG. 3C to FIG. 3D for illustration of the effects of thesecond strengthening treatment, the enhanced, deeper depth ofcompressive layer of the selectively chemically strengthened surfaceregion 310A is highlighted with expanded cross hatching in theselectively chemically strengthened surface region 310A. Similarly, amodified central region 311A in FIG. 3D is depicted as smaller, relativeto corresponding central region 311 in FIG. 3C. Of course, it should beunderstood that since depth of compressive layer differences may be onthe order of tens of microns, differences between FIGS. 3C and 3D may beshown as greatly exaggerated for ease of illustration.

Furthermore, it should be understood that the selectively chemicallystrengthened surface region 310A of the cover glass may have enhancedstrengthening, with an enhanced compressive stress that is greater thancompressive stress of the other chemically strengthened surface region308A. For example, hypothetically speaking, it is theorized that the tworegions 310A, 308A may have similar peak compressive stress of aboutseven hundred and thirty Mega Pascals. However, because of theaforementioned deeper depth of compressive layer, the selectivelychemically strengthened surface region 310A of the cover glass may havetotal accumulated compressive stress that is greater than correspondingtotal accumulated compressive stress of the other chemicallystrengthened surface region 308A.

Moreover, the selectively chemically strengthened surface region 310A ofthe cover glass may have enhanced strengthening, with an enhancedcentral tension that is greater than central tension of the otherchemically strengthened surface region 308A. For example, hypotheticallyspeaking, it is theorized that the enhanced central tension of theselectively chemically strengthened surface region 310A may be aboutninety-one Mega Pascals, while the central tension of the otherchemically strengthened surface region 308A may be about fifty-one MegaPascals.

FIGS. 4A-4E are simplified cross sectional views showing selectivestrengthening of cover glass in another embodiment. FIG. 4A shows coverglass 404 prior to a first strengthening treatment. Prior to the firststrengthening treatment, FIG. 4B shows shielding 406 of a portion of thecover glass 404, the shielding 406 providing the cover glass 404 with atleast one shielded portion 408 and at least one unshielded portion 410.Suitable masking 406 of the cover glass, as discussed previously herein,may be used for the shielding 406 of the cover glass 404. For example,as shown in FIG. 4B opposing major surfaces of the cover glass may beshielded by applied mask material 406, so as to provide the shieldedportion 408 of the cover glass. Edge extremities 410 of the cover glass404 may be unshielded portions 410. Mask 406 may be suitably patternedas desired for shielded portion 408 and unshielded portion 410.

FIG. 4C shows a cover glass 404 after the first strengthening treatment,such as treatment in a first heated potassium bath for a first period oftime as discussed previously herein. Compressive surface layer 409 fromundergoing ion exchange in unshielded portion 410A is shown using crosshatching. In some cases, potassium ions may not diffuse into a centerportion 411 of cover glass 404. In FIG. 4C the center portion 411 isshown without cross hatching.

Because it is unshielded, unshielded portion 410A may be substantiallyaffected by the first strengthening treatment. Conversely, because it isshielded, shielded portion 408A may be substantially unaffected by thefirst strengthening treatment. After the first strengthening treatment,the shielding 406 may be removed as shown in FIG. 4D.

FIG. 4E shows cover glass 404 after a second strengthening treatment,such as treatment in a second heated potassium bath for a second periodof time as discussed previously herein. Because it has already undergonethe first strengthening treatment, selectively chemically strengthenedsurface region 410B may be substantially affected by the secondstrengthening treatment. In particular, strengthening of selectivelychemically strengthened surface region 410B can be selectively enhancedby the second strengthening treatment. However, it should be understoodthat because it was previously shielded, the other chemicallystrengthened surface region 408B may not have been affected by the firstchemical strengthening treatment, and may show relatively less effectafter the second strengthening treatment. Accordingly, the selectivelychemically strengthened surface region 410B of the cover glass may haveenhanced strengthening that is greater than strengthening of the otherchemically strengthened surface region 408B. In light of the foregoing,it should be understood that the selectively chemically strengthenedsurface region 410B of the cover glass may be strengthened differentlythan the other chemically strengthened surface region 408B.

In FIGS. 4D and 4E, the selectively chemically strengthened surfaceregion 410B of the cover glass may have enhanced strengthening with anenhanced depth of compressive layer that is deeper than the depth ofcompressive layer of the other chemically strengthened surface region408B. Comparing FIG. 4D to FIG. 4E for illustration of the effects ofthe second strengthening treatment, the enhanced, deeper depth ofcompressive layer of the selectively chemically strengthened surfaceregion 410B is highlighted with expanded cross hatching in theselectively chemically strengthened surface region 410B. Similarly, amodified central region 411A in FIG. 4E is depicted as smaller, relativeto corresponding central region 411 in FIG. 4D.

Furthermore, it should be understood that the selectively chemicallystrengthened surface region 410B of the cover glass may have enhancedstrengthening, with an enhanced compressive stress that is greater thancompressive stress of the other chemically strengthened surface region408B. Moreover, the selectively chemically strengthened surface region410B of the cover glass may have enhanced strengthening, with anenhanced central tension that is greater than central tension of theother chemically strengthened surface region 408B.

FIGS. 5A-5G are simplified cross sectional views showing selectivestrengthening of cover glass in yet another embodiment. FIG. 5A showscover glass 504 prior to a first strengthening treatment. FIG. 5B showsa cover glass 504 after the first strengthening treatment, such astreatment in a first heated potassium bath for a first period of time asdiscussed previously herein. Compressive surface layer 509 fromundergoing ion exchange is shown using cross hatching. Compressivesurface layer 509 can have a corresponding depth of compressive layer.In some cases, potassium ions may not diffuse into a center portion 511of cover glass 504. In FIG. 5B the center portion 511 is shown withoutcross hatching.

FIG. 5C illustrates selective strengthening of selected surface portion510 of the cover glass 504 using a second strengthening treatment ofelectric field assisted ion exchange strengthening in a heatedenvironment, such as an electric furnace. Electrode placement may bechosen so that other surface portion 508 is substantially unaffected. Ananode paste 520 and a cathode paste 522 may each have a suitablethickness, for example about one half to about one millimeter, whereinthe pastes may comprise KNO3 and A1203 and a suitable binder, and may beapplied in contact with the cover glass 504. The anode paste 520 andcathode paste 522 may be separate from each other by a suitable mask524, for example a high temperature rubber, such as a fluorinatedrubber.

A suitable voltage may be approximately within a range from about onehundred volts to about three hundred volts, which may be applied to ananode electrode 526 (coupled to the anode paste 520) and to a cathodeelectrode 528 (coupled to the cathode paste 522) for a sufficient periodof time, for example, approximately six hours. The anode electrode 526and the cathode electrode 528 may employ a suitable metal. A noble metalsuch as platinum may be employed, or a temperature-resistant materialsuch as tungsten or molybdenum.

FIG. 5D shows a detailed view of FIG. 5C, to illustrate selectivestrengthening of selected surface portion 510 of the cover glass 504using the electric field assisted ion exchange strengthening. Notionaldashed arrows are shown in FIG. 5D to illustrate electric field assistedK⁺ ion diffusion into the selected surface portion.

FIG. 5E shows cover glass 504 after the second strengthening treatmentof electric field assisted ion exchange strengthening. FIG. 5F shows adetailed view of FIG. 5E. FIG. 5G shows electrodes removed after thesecond strengthening treatment. Strengthening of selected surface region510A of the cover glass can be selectively enhanced by the secondstrengthening treatment. Selectively chemically strengthened surfaceregion 510A may be substantially affected by undergoing both the firstand second strengthening treatment. However, the other chemicallystrengthened surface region 508A may be substantially unaffected by thesecond strengthening treatment. Accordingly, the selectively chemicallystrengthened surface region 510A of the cover glass may have enhancedstrengthening that is greater than strengthening of the other chemicallystrengthened surface region 508A. In light of the foregoing, it shouldbe understood that the selectively chemically strengthened surfaceregion 510A of the cover glass may be strengthened differently than theother chemically strengthened surface region 508A.

The selectively chemically strengthened surface region 510A of the coverglass may have enhanced strengthening with an enhanced depth ofcompressive layer that is deeper than the depth of compressive layer ofthe other chemically strengthened surface region 508A. Comparing FIG. 5Cto FIG. 5E (and comparing detailed view 5D to detailed view 5F) forillustration of the effects of the second strengthening treatment, theenhanced, deeper depth of compressive layer of the selectivelychemically strengthened surface region 510A is highlighted with expandedcross hatching in the selectively chemically strengthened surface region510A. Similarly, a modified central region 511A in FIG. 5E is depictedas smaller, relative to corresponding central region 511 in FIG. 5C.

Furthermore, it should be understood that the selectively chemicallystrengthened surface region 510A of the cover glass may have enhancedstrengthening, with an enhanced compressive stress that is greater thancompressive stress of the other chemically strengthened surface region508A. Moreover, the selectively chemically strengthened surface region510A of the cover glass may have enhanced strengthening, with anenhanced central tension that is greater than central tension of theother chemically strengthened surface region 508A.

FIGS. 6A-6E are simplified cross sectional views showing selectivestrengthening of cover glass in still yet another embodiment. FIG. 6Ashows cover glass 604 prior to a first strengthening treatment. FIG. 6Bshows a cover glass 604 after the first strengthening treatment, such astreatment in a first heated potassium bath for a first period of time asdiscussed previously herein.

Compressive surface layer 609 from undergoing ion exchange is shownusing cross hatching. Compressive surface layer 609 can have acorresponding depth of compressive layer. In some cases, potassium ionsmay not diffuse into a center portion 611 of cover glass 604. In FIG. 6Bthe center portion 611 is shown without cross hatching.

FIG. 6C shows shielding 606 of a portion of the cover glass 604, theshielding 606 providing the cover glass 604 with at least one shieldedportion 608 and at least one unshielded portion 610. Suitable masking606 of the cover glass, as discussed previously herein, may be used forthe shielding 606 of the cover glass 604. For example, as shown in FIG.6C a bottom major surface of the cover glass may be shielded by appliedmask material 606, so as to provide the shielded portion 608 of thecover glass. Edge extremities and a top major surface 610 of the coverglass 604 may be unshielded portions 610. Mask 606 may be suitablypatterned as desired for shielded portion 608 and unshielded portion610.

FIG. 6D shows cover glass 604 after a second strengthening treatment,such as treatment in a second heated potassium bath for a second periodof time as discussed previously herein. Strengthening of a selectedunshielded portion 610A of the cover glass can be selectively enhancedby the second strengthening treatment. Because it is unshielded,unshielded portion 610A may be substantially affected by the secondstrengthening treatment, so as to provide a selectively chemicallystrengthened surface region 610A. Conversely, because it is shielded,shielded portion 608A of the other chemically strengthened surfaceregion 608A may be substantially unaffected by the second strengtheningtreatment. Accordingly, the selectively chemically strengthened surfaceregion 610A of the cover glass may have enhanced strengthening that isgreater than strengthening of the other chemically strengthened surfaceregion 608A. In light of the foregoing, it should be understood that theselectively chemically strengthened surface region 610A of the coverglass may be strengthened differently than the other chemicallystrengthened surface region 608A. After the second strengtheningtreatment, the shielding 606 may be removed as shown in FIG. 6E.

In FIGS. 6D and 6E, the selectively chemically strengthened surfaceregion 610A of the cover glass may have enhanced strengthening with anenhanced depth of compressive layer that is deeper than the depth ofcompressive layer of the other chemically strengthened surface region608A. Comparing FIG. 6C to FIG. 6D for illustration of the effects ofthe second strengthening treatment, the enhanced, deeper depth ofcompressive layer of the selectively chemically strengthened surfaceregion 610A is highlighted with expanded cross hatching in theselectively chemically strengthened surface region 610A. Similarly, amodified central region 611A in FIG. 6D is depicted as smaller, relativeto corresponding central region 611 in FIG. 6C.

Furthermore, it should be understood that the selectively chemicallystrengthened surface region 610A of the cover glass may have enhancedstrengthening, with an enhanced compressive stress that is greater thancompressive stress of the other chemically strengthened surface region608A. Moreover, the selectively chemically strengthened surface region610A of the cover glass may have enhanced strengthening, with anenhanced central tension that is greater than central tension of theother chemically strengthened surface region 608A.

FIG. 7 is a flow diagram illustrating an assembly process 700 of oneembodiment. The assembly process 700 may begin with obtaining 702 acover glass. The assembly process 700 may continue with shielding 704 aportion of the cover glass. The shielding may provide the cover glasswith at least one shielded portion and at least one unshielded portion.In one embodiment, such shielding 704 may involve patterning (or, moreparticularly, photolithographic patterning) on the cover glass.

The assembly process 700 may continue with chemically strengthening 706the at least one unshielded portion of the cover glass. The at least oneunshielded portion of the cover glass may be exposed to ion exchange.The assembly process 700 may continue with subsequently attaching 708the cover glass to the housing. Once the cover glass has been attachedto the housing, the assembly process 700 can end.

FIG. 8 is a flow diagram showing another embodiment of an assemblyprocess 800. The assembly process 800 may begin with obtaining 802 acover glass. The assembly process 800 may continue with shielding 804 aportion of the cover glass. The shielding may provide the cover glasswith at least one shielded portion and at least one unshielded portion.In one embodiment, such shielding 804 may involve patterning (or, moreparticularly, photolithographic patterning) on the cover glass.

The assembly process 800 may continue with chemically strengthening 806the at least one unshielded portion of the cover glass. The at least oneunshielded portion of the cover glass may be exposed to ion exchange.The assembly process 800 may continue with removing 808 the shielding.The assembly process 800 may continue with a second chemicalstrengthening 810 of the cover glass. The assembly process 800 maycontinue with subsequently attaching 812 the cover glass to the housing.Once the cover glass has been attached to the housing, the assemblyprocess 800 can end.

FIG. 9 is a flow diagram showing yet another embodiment of an assemblyprocess 900. The assembly process 900 may begin with obtaining 902 acover glass. The process 900 may begin with a first chemicalstrengthening 904 of the cover glass. The assembly process 900 maycontinue with shielding 906 a portion of the cover glass. The shieldingmay provide the cover glass with at least one shielded portion and atleast one unshielded portion. In one embodiment, such shielding 906 mayinvolve patterning (or, more particularly, photolithographic patterning)on the cover glass.

The assembly process 900 may continue with second chemicalstrengthening. In particular, the assembly process 900 may continue withchemically strengthening 908 the at least one unshielded portion of thecover glass. The at least one unshielded portion of the cover glass maybe exposed to ion exchange. The assembly process 900 may continue withremoving 910 the shielding. The assembly process 900 may continue withsubsequently attaching 912 the cover glass to the housing. Once thecover glass has been attached to the housing, the assembly process 900can end..

FIG. 10 is a flow diagram showing still another embodiment of anassembly process 1000. The assembly process 1000 may begin withobtaining 1002 a cover glass. The assembly process 1000 may continuewith chemically strengthening 1004 the cover glass. The assembly process1000 may continue with selectively enhancing 1006 strengthening of aselected portion of the cover glass. The assembly process 1000 maycontinue with subsequently attaching 1008 the cover glass to thehousing. Once the cover glass has been attached to the housing, theassembly process 1000 can end.

FIG. 11 is a perspective view of an electronic device in accordance withanother embodiment. As particularly shown in FIG. 11 , a selectivelychemically strengthened surface region 1110A may comprise a selectivelystrengthened edge extremity 1110A of the cover glass. The selectivelychemically strengthened surface region 1110A may have a width dimension,w, extending inwardly from peripheral edges of the cover glass. In otherwords, the selectively strengthened edge extremity 1110A may have awidth dimension, w. The width dimension may be about two to fivemillimeters, or more. For example the width dimension may be about tenmillimeters. A notional dashed line in FIG. 11 representativelyillustrates an inner extent of the selectively chemically strengthenedsurface region 1110A.

Similarly the cover glass may have one or more apertures 1130B, 1130Cextending through the cover glass, and one or more aperture edge regions1110B, 1110C each adjacent to a respective one the apertures 1130B,1130C. The selectively chemically strengthened surface region mayfurther comprise the aperture edge regions 1110B, 1110C of the coverglass, each a respective width dimension, w.

Additional information on selective glass strengthening may be containedin U.S. Pat. Application No. 12/847,926, filed Jul. 30, 2010, andentitled “ELECTRONIC DEVICE HAVING SELECTIVITY STRENGTHENING GLASS COVERGLASS,” which is hereby incorporated herein by reference.

Additional information on strengthening variable thickness glass iscontained in U.S. Provisional Pat. Application No. 61/453,398, filedMar. 16, 2011, and entitled “STRENGTHENING VARIABLE THICKNESS GLASS”,which is hereby incorporated herein by reference; and in U.S. Pat.Application No. 13/235,036, filed concurrently herewith, and entitled“STRENGTHENING VARIABLE THICKNESS GLASS”, which is hereby incorporatedherein by reference

The advantages of the invention are numerous. Different aspects,embodiments or implementations may yield one or more of the followingadvantages. One advantage is that cover glass can be selectivelystrengthened in high damage risk areas such as edge extremity regions.Another advantage is that cover glass can be selectively strengthenedadjacent to apertures where damage risk may be higher, due to defectsintroduced in machining or grinding in forming of the apertures. Anotheradvantage is that high damage risk areas can be strengthened whilelimiting increases in overall central tension of the cover glass, andpossible deleterious effects of over strengthening, by selectivelystrengthening selected portions of the cover glass.

The many features and advantages of the present invention are apparentfrom the written description and, thus, it is intended by the appendedclaims to cover all such features and advantages of the invention.Further, since numerous modifications and changes will readily occur tothose skilled in the art, the invention should not be limited to theexact construction and operation as illustrated and described. Hence,all suitable modifications and equivalents may be resorted to as fallingwithin the scope of the invention.

1. A consumer electronic product, comprising: a housing; electricalcomponents disposed at least partially internal to said housing; and acover glass coupled with the housing, wherein the cover glass comprisesa selectively chemically strengthened surface region.
 2. The consumerelectronic product as recited in claim 1 wherein: the cover glassfurther comprises an other chemically strengthened surface region; andthe selectively chemically strengthened surface region of the coverglass has enhanced strengthening that is greater than strengthening ofthe other chemically strengthened surface region.
 3. The consumerelectronic product as recited in claim 1 wherein: the cover glassfurther comprises an other surface region that is chemicallystrengthened with a compressive stress; and the selectively chemicallystrengthened surface region of the cover glass has enhancedstrengthening with an enhanced compressive stress that is greater thanthe compressive stress of the other chemically strengthened surfaceregion.
 4. The consumer electronic product as recited in claim 1wherein: the cover glass further comprises an other surface region thatis chemically strengthened with a depth of compressive layer; and theselectively chemically strengthened surface region of the cover glasshas enhanced strengthening with an enhanced depth of compressive layerthat is deeper than the depth of compressive layer of the otherchemically strengthened surface region.
 5. The consumer electronicproduct as recited in claim 1 wherein: the cover glass further comprisesan other surface region that is chemically strengthened with a centraltension; and the selectively chemically strengthened surface region ofthe cover glass has enhanced strengthening with an enhanced centraltension that is greater than the central tension of the other chemicallystrengthened surface region.
 6. The consumer electronic product asrecited in claim 1 wherein the selectively chemically strengthenedsurface region of the cover glass is patterned.
 7. The consumerelectronic product as recited in claim 1 wherein the selectivelychemically strengthened surface region of the cover glass is formed witha photolithographic pattern provided on the cover glass.
 8. The consumerelectronic product as recited in claim 1 wherein the selectivelychemically strengthened surface region comprises an edge extremity ofthe cover glass.
 9. The consumer electronic product as recited in claim1 wherein: the cover glass has at least one aperture extending throughthe cover glass, and an aperture edge region adjacent to the aperture;and the selectively chemically strengthened surface region comprises theaperture edge region of the cover glass.
 10. The consumer electronicproduct as recited in claim 1 wherein: the cover glass further has afirst major surface region that is chemically strengthened; and theselectively chemically strengthened region of the cover glass comprisesan opposing major surface of the cover glass that has enhancedstrengthening, which is greater than strengthening of the first majorsurface of the cover glass.
 11. A method for assembling an electronicproduct comprising: obtaining cover glass; selectively chemicallystrengthening one surface region of the cover glass differently thanchemically strengthening an other surface region of the cover glass; andsubsequently attaching the cover glass to a housing for the electronicproduct.
 12. The method as recited in claim 11 wherein the selectivelychemically strengthening comprises enhanced strengthening of the onesurface region that is greater than strengthening of the other surfaceregion.
 13. The method as recited in claim 12 wherein the enhancedstrengthening of the one surface region comprises electric fieldassisted ion exchange strengthening.
 14. The method as recited in claim12 wherein the strengthening of the other surface region comprisesdisposing the other surface region in a heated solution for a period oftime, so as to allow at least one component of the heated solution todiffuse into the other surface region.
 15. The method as recited inclaim 12 wherein the enhanced strengthening of the one surface regioncomprises both: a) electric field assisted ion exchange strengthening ofthe one surface region and b) disposing the one surface region in aheated solution for a period of time, so as to allow at least onecomponent of the heated solution to diffuse into the one surface region.16. The method as recited in claim 12 wherein the enhanced strengtheningof the one surface region comprises both: a) disposing the one surfaceregion in a first heated solution for a first period of time, so as toallow at least one component of the first heated solution to diffuseinto the one surface region b) disposing the one surface region in asecond heated solution for a second period of time, so as to allow atleast one component of the second heated solution to diffuse into theone surface region.
 17. The method as recited in claim 12 wherein: theone surface region comprises a peripheral edge region; and the enhancedstrengthening of the one surface region comprises enhanced strengtheningof the peripheral edge region.
 18. A method for assembling an electronicproduct comprising: obtaining cover glass; shielding a portion of thecover glass, the shielding providing the cover glass with at least oneshielded portion and at least one unshielded portion; chemicallystrengthening the at least one unshielded portion of the cover glass;and subsequently attaching the cover glass to a housing for theelectronic product.
 19. The method as recited in claim 18 whereinstrengthening comprises patterning the at least one shielded portion ofthe cover glass.
 20. The method as recited in claim 18 whereinstrengthening comprises photolithographically patterning the at leastone shielded portion of the cover glass.